MicroElectronic Packaging Engineer - Skyworks Solutions

Location:
Cedar Rapids, IA

PRIMARY RESPONSIBILITY:
• Support the design, prototype assembly, documentation and release to production of new RFIC and multi-chip module (MCM) packages using appropriate technology.
• Acts as a liaison with internal Advanced Packaging Group, Suppliers, and Internal and External Manufacturing.
• Direct and potentially manage Packaging resources used in build, design, development and documentation of industry leading wireless semiconductor products.
• Using appropriate tools, perform product cost trade-offs, package integrity analysis (thermal, mechanical, cross-sectioning, assembly process, etc.) for customer and internal requirements.
• Define package requirements for product groups assuring compliance with customer and internal Quality and Reliability requirements.
• Support the design and development of test fixture assemblies for product development and production test.

This individual must work well in a team on problems of a diverse scope where analysis of situations or data requires a review of identifiable factors. Must exercise judgment within defined procedures and practices to determine appropriate solutions. This position requires a BS degree and 2 years minimum of experience with knowledge of state-of-the-art materials and packaging related to semiconductor technology. Experience with Thermal and Mechanical Analysis, Auto-CAD and Cadence APD or similar CAD tools is a preference. A basic understanding of Micro-Electronic Packaging and Manufacturing is also highly preferred

MicroElectronic Packaging Engineer - Skyworks Solutions - RF Cafe Forums