I would like to apply my resume to Korea site or
another site. If you have any question my resume,
please contact my E-mail address.
Nationality
: Korea
Name : Simon Lim
Cell phone : 82-10-2424-1155
E-mail :
ism1155@shinbiro.com
Target Occupation : Hardware/RF/SiP module Engineer
EDUCATION BACKGROUND : Computer & communication
engineering Choung-ju university Graduation
Man power :
Fully capability from design
module which is verified with simulation to Testing
spec.
Carrier-------------------------------------------
Codial.co.ltd Hardware team 2002 ~ 2004 year
Main job – Development Circuit for CDMA celluer
phone.
Development RF&Multimedia part in
laminated PCB for CDMA celluer phone.
2002
year - Followed up CDMA Celluer phone @450MHz MSM
5100 base for Synertek mobile phone.
2003 year
- Development CDMA Celluer phone@800 MHz MSM 5100
base for Arima, Amoisonic mobile phone.
2004
year - Development Triple mode CDMA Celluer phone
@MSM 6100 base for Super board for testing.
Jahwa electronics.co.ltd R&D 1 team 2004~2008
year
Main job – Development Circuit for RF module with
LTCC (Low Temperature Co-fired Ceramic) carrier.
Development RF part in LTCC carrier for GSM celluer
phone.
2004 year - Development Dual band
GSM900, DCS1800 Antenna switch module (4.5x3.2 mm)
for SEC GSM mobile phone.
2005 year - Development
Triple band GSM900, DCS1800, PCS1900 Antenna switch
module (4.5x3.2 mm) for SEC GSM mobile phone.
2006 year - Development Dual band GSM900, DCS1800
Front End module (5.4x4.0 mm) for SEC GSM mobile
phone.
2007 year - Development Triple band GSM900,
DCS1800, PCS1900 Front End module (5.4x4.0 mm) for
SEC GSM mobile phone.ASE Korea R&D
team 2008 year ~ Now
Main job – Development
Circuit for RF/SiP/Power module with various carrier
(Laminated PCB, LTCC..)
Development RF/Power/Digital
part in various carrier for Mobile and PC application.
2008 year - Development 2.45GHz Zigbee System in
Package Module 10 x 10 mm for Radiopulse
2008
year – Development DCDC converter(Buck) System in
Package Module 15 x 15 mm for Intersil.
2008
year – Development 3Gbps SATA controller FBGA 14x14mm
for Indilinx.
2009 year - Development 2.45GHz
Zigbee System in Package Module 9 x 9 mm for Radiopulse
with included
Embedded Passive Discrete to apply
to low cost model.
2009 year - Development DCDC
converter (Buck) System in Package Module 10 x 15
mm for MAXIM.
2009 year - Development 2.45GHz
Zigbee USIM card for Radiopulse.
2009 year -
Development 900MHz RFID USIM card for Radiopulse.
2009 year - Development Power Management Module
; W/B+WLCPS combo 12x12mm for QCT.
2010 year
– Development 900MHz UHF band Balun+LPF LTCC type
module 3.5x3.5mm for Radiopulse.
2010 year -
Development 2.45GHz Zigbee + 1GB Flash RAM MicroSD
card for Radiopulse.
Master grade
skill
Design tool: Mentor PowerPCB, logic,
Cadence Allegro Package Designer, Cadence CIS.
Simulation tool: Agilent ADS, Momentum, Ansoft HFSS,
Links, RLC extractor.
Measurement tool: Oscilloscope,
Signal generator, Spectrum analyzer, Network analyzer…
Fully capability from design module which is
verified with simulation to Testing spec.
