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(Title) |
 Welcome to the RF Cafe Jobs website, where a mix of engineer, technician, manager, and
sales job opportunities are posted on behalf of companies that are actually doing the hiring. If you are responsible for hiring in your company,
please contact me AFTER reading the Terms of Use.
- NO RECRUITERS. NO EXCEPTIONS - See most recent list of job openings here.
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Posted 4/21/2011
Microelectronic Packaging Engineer
Location: Cedar Rapids
PRIMARY RESPONSIBILITY:
• Support the design, prototype assembly, documentation and release to production of new RFIC and multi-chip
module (MCM) packages using appropriate technology.
• Acts as a liaison with internal Advanced Packaging Group,
Suppliers, and Internal and External Manufacturing.
• Direct and potentially manage Packaging resources used
in design, development and documentation of industry leading wireless semiconductor products.
• Using
appropriate tools, perform product cost trade-offs, package integrity analysis (thermal, mechanical,
cross-sectioning, assembly process, etc.) for customer and internal requirements.
• Define package requirements for product groups assuring compliance with customer and internal Quality and
Reliability requirements.
• Support the design and development of test fixture assemblies for product
development and production test.
BS required + minimum 5 years experience. MS preferred
deb.bunting@skyworksinc.com for more info.
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