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Engineers Using IC-CAP
Platform Report 50-Percent Faster Extraction Flow
PALO ALTO, Calif.,
Jan. 30, 2006 -- Agilent Technologies Inc. (NYSE: A) today announced a major breakthrough
in device modeling speed and efficiency with its Integrated Circuit Characterization
and Analysis Program (IC-CAP) software platform. Device modeling engineers are reporting
extraction flow improvements of up to 50 percent when using the new modeling algorithms
and data interface in IC-CAP.
“We worked very closely with major foundries
in Taiwan and the U.S. to identify their most important, next-generation modeling
requirements,” said Jim McGillivary, general manager with Agilent’s EEsof EDA division.
“These customers told us that process characterization is on the critical path to
their success. Today’s announcement emphasizes our significant and ongoing investment
in device modeling. And what’s really exciting is that these customers are responding
by standardizing on our flow.”
According to McGillivary, the increased investment
in IC-CAP is consistent with the company’s broader strategy to expand its overall
high-frequency EDA offering with a combination of internal development, partnerships
and acquisitions. The strategy includes the recent acquisition of the Eagleware-Elanix
line of price-performance RF circuit and system design software, and recent plans
to introduce a new product for full 3D electromagnetic simulation.
software is used by semiconductor foundries to accurately characterize foundry processes,
resulting in reduced design cycles, decreased manufacturing costs and faster time
More information about IC-CAP 2006A is available at www.agilent.com/find/eesof-IC-CAP2006A_image.
A high-resolution image of Agilent’s EDA solutions is available at www.agilent.com/find/eesof-IC-CAP2006A_image.
U.S. Pricing and Availability
IC-CAP 2006A is available now, with prices
starting at approximately $13,000. Current IC-CAP customers with active support
contracts will receive the 2006A release as a free software upgrade. The new features
described in this release are included in the BSIM4.4 toolkit, available now for
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Information in this
news release applies specifically to products available in the United States. Product
availability and specifications may vary in other markets.
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